| Layer Count |
2-48 Layers |
2-48 Layers |
50+ Layers |
| Laminate Materials |
|
|
|
| FR4 Tg 140 |
Yes |
Yes |
Yes |
| FR4 Tg 170 |
Yes |
Yes |
Yes |
| FR4 Tg 180 |
Yes |
Yes |
Yes |
| GETEK |
Yes |
Yes |
Yes |
| Polyimide |
Yes |
Yes |
Yes |
| Rogers RF |
Yes |
Yes |
Yes |
| TaconicRF |
Yes |
Yes |
Yes |
| Arlon RF |
Yes |
Yes |
Yes |
| Duriod |
Yes |
Yes |
Yes |
| RoHS Materials |
Yes |
Yes |
Yes |
| Halogen Free |
Yes |
Yes |
Yes |
| Aluminum Backing |
Yes |
Yes |
Yes |
| Brass Backing |
Yes |
Yes |
Yes |
| Copper Backing |
Yes |
Yes |
Yes |
| Bergquist |
Yes |
Yes |
Yes |
| Laird |
Yes |
Yes |
Yes |
| C-LECPlastic |
Yes |
Yes |
Yes |
| Speed Board |
Yes |
Yes |
Yes |
| Flex Substrates |
Yes |
Yes |
Yes |
| Board Types |
|
|
|
| Rigid |
yes |
yes |
yes |
| Rigid-Flex |
yes |
yes |
yes |
| Flex |
yes |
yes |
yes |
| RF Microwave |
yes |
yes |
yes |
| Mix Dielectrics / Hybrid Material |
yes |
yes |
yes |
| Dielectrics With Metal Core/Backing |
yes |
yes |
yes |
| Panel Sizes |
Standard Panel |
Non-Standard Panel |
|
| 12 X 18 |
Yes |
No |
|
| 16 X 18 |
Yes |
No |
|
| 16 x 21 |
No |
Yes |
|
| 18 X 24 |
Yes |
No |
|
| 21 x 24 |
No |
Yes |
|
| 22 x 28 |
No |
Yes |
|
| 47″ x 47″ (maximum working panel 2 layers) |
No |
Yes |
|
| 39″ x 39″ (maximum working panel 4-8 layers) |
No |
Yes |
|
| 27″ x 27″ (maximum working panel 10 layers) |
No |
Yes |
|
| ** Panel Utilization CanVary On Panel Area Depending On Design, IPC Coupons & TDR Coupons. |
| Board Types |
|
|
|
| Finish Thickness |
.003″ to .200″ |
.003″ to .500″ |
> .500 |
| Minimum Core Thickness |
.004″ |
.003″ |
.002″ |
| Finished Thickness Tolerance |
10% |
7% |
5% |
| Multiple Lamination Cycles |
5 |
7 |
7+ |
| Copper Foil Weights (Internal Layers) |
1/2 – 3 OZ |
1/4 – 4 OZ |
1/4 – 6 OZ |
| Copper Foil Weights (External Layers) |
1/2 – 3 OZ |
1/4 – 4 OZ |
1/4 – 6 OZ |
| Pad, Lines & Spacing Diameters |
|
|
|
| External LineWidth |
.004″ |
.003″ |
.002″ |
| External Spacing |
.004″ |
.003″ |
.002″ |
| Internal LineWidth |
.004″ |
.003″ |
.002″ |
| Internal Spacing |
.004″ |
.003″ |
.002″ |
| External PadSize – Annual Ring Per Side |
.005″ |
.004″ |
.003″ |
| Internal PadSize – Annular Ring Per Side |
.005″ |
.004″ |
.003″ |
| SMT Pitch |
.040″ |
.030″ |
.020″ |
| BGA Pitch |
.040″ |
.030″ |
.020″ |
| Impedance |
10% |
5% |
2.5% |
| Plating Finishes |
|
|
|
| ENIG (Electroless NickelImmersion Gold) |
Yes |
Yes |
Yes |
| Immersion Silver |
Yes |
Yes |
Yes |
| Immersion White Tin |
Yes |
Yes |
Yes |
| HASL (60/40 Tin-Lead) |
Yes |
Yes |
Yes |
| HAL (Lead-Free) |
Yes |
Yes |
Yes |
| Nickel(Electroplated) |
Yes |
Yes |
Yes |
| Palladium (Electroplated) |
Yes |
Yes |
Yes |
| Gold (Electroplated) |
Yes |
Yes |
Yes |
| Soft Wire Bondable Gold |
Yes |
Yes |
Yes |
| OSP (Organic Surface Protection) |
Yes |
Yes |
Yes |
| Carbon Ink |
Yes |
Yes |
Yes |
| Selective Plating |
Yes |
Yes |
Yes |
| RoHSFinishes |
|
|
|
| ENIG (Electroless NickelImmersion Gold) |
Yes |
Yes |
Yes |
| Immersion Silver |
Yes |
Yes |
Yes |
| Immersion White Tin |
Yes |
Yes |
Yes |
| HAL (Lead-Free) |
Yes |
Yes |
Yes |
| OSP (Organic Surface Protection) |
Yes |
Yes |
Yes |
| Soft Wire Bondable Gold |
Yes |
Yes |
Yes |
| Tolerances |
|
|
|
| Hole Aspect Ratio |
10:1 |
15:1 |
20:1 |
| Drilled Hole To Copper |
.008″ |
.005″ |
< .005" |
| Plated Hole Tolerances (+/-) |
.003″ |
.002″ |
<.002" |
| Non Plated Hole Tolerances (+/-) |
.001″ |
.001″ |
.001″ |
| Fabrication Tolerances (+/-) |
.005″ |
.003″ |
<.003" |
| Board thickness Tolerance(+/-) |
10% |
|
|
| Via Holes |
|
|
|
| Laser Micro Vias |
0.004 * |
0.003 * |
0.002 * |
| BlindVias |
.0063″ |
.0063″ |
.0063″ |
| Buried Vias |
.0063″ |
.0063″ |
.0063″ |
| Via HolesUnder PAD |
Yes |
Yes |
Yes |
| Laser Drill |
Pending |
Pending |
Pending |
| Mechanical Drill Vias |
.0063″ |
.0063″ |
.0063″ |
| Tented Vias |
Coated with LPI |
Coated/Plugged |
Coated/Plugged |
| Silver Conductive Via Filled |
Yes |
Yes |
Yes |
| Copper Conductive Via Filled |
Yes |
Yes |
Yes |
| Non-Conductive Via Filled |
Yes |
Yes |
Yes |
| Copper Plated Plugged Vias (80%) .008″ Min |
Yes |
Yes |
Yes |
| Automated Planarization Capability |
Yes |
Yes |
Yes |
| Automated Planarization Capability |
* Laser Drilling outsourced |
|
|
| Routing/Scoring |
|
|
|
| Scoring (Jump) |
Yes |
Yes |
Yes |
| Scoring (Jump) Min length 1″ |
Yes |
Yes |
Yes |
| Scoring Webb .014 +/- .003 Min |
Yes |
Yes |
Yes |
| Routed/Plated Edges |
Yes |
Yes |
Yes |
| Routed/Plated Pockets & Cuts Outs |
Yes |
Yes |
Yes |
| Z-Depth Routing (Plated Pockets & Cutouts) |
Yes |
Yes |
Yes |
| Cavities (Plated & Non-Plated) |
Yes |
Yes |
Yes |
| Soldermask |
|
|
|
| LPI(Liquid Photo Imagable Soldermask) |
Yes |
Yes |
Yes |
| Soldermask Colors |
All Avail.Colors |
All Avail.Colors |
All Avail.Colors |
| Soldermask Type |
LPI |
LPI |
LPI |
| Dry FilmSoldermask |
Yes |
Yes |
Yes |
| Minimum Mask Clearance (LPI)Per Side |
.003″ |
.002″ |
.001″ |
| Minimum Mask Clearance (Dry Film) |
.003″ |
.003″ |
.003″ |
| Minimum Soldermask Thickness (LPI) |
.0005″ |
.0004″ |
.0004″ |
| Minimum Soldermask Thickness (Dry Film) |
.003″ |
.003″ |
.003″ |
| Soldermask Web Minimum (LPI) |
.004″ |
.003″ |
.003″ |
| Soldermask Web Minimum (Dry Film) |
.010″ |
.008″ |
.008″ |
| Silkscreen/Legend |
|
|
|
| Silkscreen/Legend Colors |
All Avail.Colors |
All Avail.Colors |
All Avail.Colors |
| Silkscreen/Legend Feature Size |
.008″ W X .030 H Min. |
.008″ W X .030 H Min. |
.008″ W X .030 H Min. |
| Flatness |
IPSStandard |
IPC Standard |
IPC Standard |
| Electrical Testing |
|
|
|
| Netlist Testing |
Yes |
Yes |
Yes |
| Flying Probe |
Yes |
Yes |
Yes |
| Clamshell Fixture |
Yes |
Yes |
Yes |
| Netlist IPC-356A |
Yes |
Yes |
Yes |
| Controlled Impedance |
|
|
|
| Controlled Impedance Testing |
Yes |
Yes |
Yes |
| TDR Tester (Polar Instruments) |
Yes |
Yes |
Yes |
| Impedance tolerance (+/-) |
10% |
5% |
2.50% |
| CAM |
|
|
|
| Genesis 2000 |
Yes |
Yes |
Yes |
| ODB++ |
Yes |
Yes |
Yes |
| FTPSite |
Yes |
Yes |
Yes |
| Certifications & Standards |
|
|
|
| AS9100Certified |
Yes |
Yes |
Yes |
| ISO 9001:2008 Certified |
Yes |
Yes |
Yes |
| MIL-PRF-31032 Certified |
Pending late 2011 |
Pending late 2011 |
Pendind late 2011 |
| ITAR Registered |
Yes |
Yes |
Yes |
| IPC Standards |
Yes |
Yes |
Yes |
| IPC-6012 Class 1,2,& 3 |
Yes |
Yes |
Yes |
| IPC-6013 Class 1,2,& 3 |
Yes |
Yes |
Yes |
| IPC-6018 Class 1,2 & 3 |
Yes |
Yes |
Yes |
| MIL-PRF-55110 Certified FR4/GFN |
Yes |
Yes |
Yes |
| MIL-PRF-55110 Certified Polyimide/GIN |
Yes |
Yes |
Yes |
| Certified Etchback On Mil-PRF-55110 |
Yes |
Yes |
Yes |
