High Density Interconnection In Hole

HDI Technology in Hole

High density interconnection

High Density Interconnection

HDI Density 3
HDI Density 4
HDI Density 5
HDI Density 6

Blind & Burried 9+2+9 Laser Drill

HDI Density intterconnection 3

Market Trend vs. Technology Solution

HDI Density interconnection 5

HDI Process Flow

HDI Density interconnection 6

Main Process of Build – up Layer

Construction Materials

  • FR 4 Tetra Function ( Tg. 130 – 140 ℃ )
  • FR 4 High Tg ( Tg. 160 – 180 ℃ )
  • RCC ( Tg. 150 ℃ & Tg. 185 ℃ )
  • Ink ( VIL )

Comparison of Material

Prepreg RCC
Low Cost ++ –
Strength ++ +
Hole wall roughness – +
Laminating control + –
Dielectric thickness 45um ~ 30um ~ 80um
Smear residue on target pad – ++
Dielectric constant 3.9 ~ 4.7 3.2 ~ 3.8
Shelf time ++ +
Working PNL size ++ +

Comparison of Via Technologies

Mechanical Drilling Laser Drilling
Low Cost in Equipment ++ +
Low Cost in Production + ++
Required Facilities Drilling Machine Laser Machine
Consumable Drill Bits, Backup Board None
Aspect Ratio 9 1
Via Size Capacity 200 um~ 50~100um
Speed 140 H/min 20,000 H/min
Throughput – +

Comparison of Blind Via

Prepreg

RCC

HDI density interconnection 7
HDI density interconnection 7

Build-up for 2 + N + 2

Through Hole

Inner Laser Via

Stack Hole

Inner Via Hol

Surface Laser Via

HDI Density 7

Laser Via Quality

HDI Density 7

1+6+1 without buried, extend to 1+N+1

1+4+4+1 with buried via, extend to 1+N+N+1

2+4+2 laser via on laser via

HDI density 8

2+4+2 Staggered via, extend to 2+N+2

HDi Density interconnection 8

Blind via Capability

4- Layer Core Receiving

hole 1

I.V.H.(Inner Via Hole) Drilling

hole 2

Electroless Copper Plating

hole 5

Electro Plating

hole 3

Inner Via Hole Plugging
( for thickness >= 60 mil )

hole 4

I.V.H.Grinding
( for thickness >= 60 mil )

Dry Film Lamination

D.F. Exposure / Developing

Etching

D.F. Strip

Black Oxide Treatment

Prepreg Layup

Lamination

Dry Film Lamination

D.F. Exposure / Developing

Etching

D.F. Strip

Mechanical Drilling for TH

Laser Drlling for Blind Via

Desmear / Electroless Copper Plating

Electro Plating

Dry film, Exposure & DES

Solder Mask Printing

S/M Exposure / Developing

Surface Finish

Symbol Mask Printing

Inspection