Flex and Rigid Hybrid Board

Flex + Rigid Hybrid Board

Flex + Rigid Hybrid Board

Flexible Board

Polyimide kapton

Blind & Burried 1+FLEX+1 Laser drill

  • Material:
  • Flex:L2~L3 TU-768:L1~L0 L0~L4
  • Laser:L4~L0 laser via:0.006″
  • dielec tricthickness: 0.0035″~0.0045″
  • No VIPPO

Construction Materials

Material Type
    • PI thic:1~3mils
    • Coverlay thic:2mils Ink thic:0.5~0.9mils
    • Adhesive thic:1~2mils (Polyester)
    • Nonflow PP 47N 49N thic:2.5mils
    • Stiffener PI FR4 AL
    • Copper ED RA
    • EMI SF-PC5500 thic:0.6~0.8mils

    Cu + adhesive thic:2.4mils

    Blind vias

    • Copper windowing
    • Laser via
    • Copper plating
    • Coverlay/Soldermask
    • Fab.: CNC, Laser cutting
    • Stiffener

Flex Main Equipments

Material Type
Precision hot-Air Oven
Precision hot-Air Oven
Laser cutting
Laser cutting

Material Aluminum & FLEX base

Material

  • FR4-ISOLA370HR Aluminu flex

Capability